If you buy SiC wafers, the substrate market you face today is not one market. Six-inch has been driven down by oversupply into what is, in effect, a commoditized market; eight-inch has only just entered volume production and has not yet formed a standard market price at all. Between the two, the supplier landscape is being redrawn at speed — the largest US substrate maker has come out the other side of bankruptcy protection, and Korea's only dedicated SiC substrate affiliate entered liquidation in July 2026. This is a phase in which comparing the numbers on quotations is no longer enough to read the market.
The problem: six-inch has a price, eight-inch does not
The six-inch substrate price trajectory looks like this.
| Period | 6-inch substrate price (per wafer) | Source |
|---|---|---|
| Mid-2024 | Fell below $500 | TrendForce (Oct 2024) |
| Q4 2024 | $400 or lower | TrendForce (Oct 2024) |
| 2025 | Mainstream quotes around $400, near-cost selling spreads | TrendForce (Nov 2025) |
| July 2026 | Reported to have bottomed out and begun rebounding — no specific prices published | Industry reports (Jul 2026) |
The July 2026 rebound reports say supply has tightened and premiums have started to attach to incremental volume, but no specific price figures were published. As an aside: the widely repeated claim that six-inch substrates once sold "around $1,500" before the collapse circulates broadly in the industry, but we could not confirm a primary source for that figure, so we do not use it as a baseline.
Eight-inch is a different situation — public price information simply stops. Piecing together TrendForce-affiliated reports, average quotes in China went from $3,000–4,000 at the end of 2023 to about $2,000 in Q2 2024 — halving in six months — and were estimated at around $1,000 in Q1 2025. There is no published price after that. The consistent account in those same sources is that eight-inch is still in pilot production and a standard market price has not formed, and we likewise could not confirm actual 2026 eight-inch transaction prices from any public source. In practice, that means there is no market baseline to compare a quotation against.
Why it happened: Chinese oversupply and the flight to eight-inch
What broke the six-inch price
China added substrate capacity far faster than demand grew. According to digitimes tallies (Oct 2024), China's annual SiC substrate capacity expanded as follows.
| Year | China SiC substrate capacity (annual) |
|---|---|
| 2022 | 460,000 wafers |
| 2023 | 1.17 million wafers |
| 2024 (projected) | 2.22 million wafers |
| 2025 (projected) | 3.90 million wafers |
On the 2025 projection, that is more than an eightfold build-out in three years. Demand did not keep pace — per Yole (Dec 2025), 2025 upstream (substrate and epi) utilization ran at about 50% and device lines at about 70%, and with the EV slowdown layered on top, Yole expects the downturn to last through 2027–2028. The result: global N-type substrate revenue in 2024 was $1.04 billion, down 9% year over year (TrendForce, May 2025). Capacity exploded while the market itself shrank. The EV slowdown shows up in device-maker results too — STMicroelectronics' 2025 annual revenue was $11.80 billion, down 11.1% from the prior year (ST annual report, 2026). The broader picture of how China's six-inch build-out pressures prices is covered in our 2026 SiC market outlook.
The market-share map has already shifted. On TrendForce's May 2025 figures, Wolfspeed led 2024 N-type substrate revenue at 33.7%, but the top two Chinese substrate makers combined for 34.4% — already matching Wolfspeed. The top four suppliers (two of them Chinese) held 82% between them. On a capacity basis, Chinese players account for roughly 40% of SiC wafer and epiwafer capacity (Yole, Dec 2025). Nor is Chinese material confined to the low end — in May 2023, Infineon signed long-term supply agreements with two Chinese substrate makers, starting at 150mm with a second phase planned at 200mm. A Western IDM formally bringing Chinese substrates into its qualified supply chain.
The move to eight-inch, and how fast it is actually going
With six-inch pushed to near cost, the Western, Japanese, and Korean camps are moving to eight-inch (200mm). The wafer area grows about 78%, and counting the reduced edge loss, die count rises about 85% (Power Electronics News). But the same source is explicit that the per-die saving is not immediate — for a 1.2kV/100A MOSFET, 200mm per-die cost is projected to come in about 20% below 150mm over five to seven years, and in the early phase of the transition there is no saving at all, because of substrate prices and process immaturity.
The major players' 200mm timelines:
| Company | Site | 200mm status |
|---|---|---|
| Wolfspeed | Mohawk Valley, New York, US | World's first dedicated 200mm SiC device fab, operating since 2022. The 150mm device fab (Durham) closed, production transferred |
| Infineon | Villach, Austria and Kulim, Malaysia | First 200mm-based products shipped to customers in Q1 2025 |
| STMicroelectronics | Catania, Italy | Production starting 2026, full capacity (15,000 wafers/week) by 2033, roughly €5 billion investment |
| Bosch | Roseville, California, US | Acquired fab being converted to 200mm, first commercial chips targeted for 2026. Up to $225 million in direct CHIPS funding finalized (Jul 2026) |
| onsemi | Bucheon, South Korea | Combined 150/200mm line. Per analyst reporting, 200mm qualified in 2025, ramping in 2026. Over 1 million 200mm wafers per year at full capacity |
Mitsubishi Electric (a planned new fab in Kumamoto) and Rohm (its Miyazaki site) have also announced eight-inch plans, but we could not confirm their status as of 2026 from primary sources, so we have left them out of the table. China has entered eight-inch as well — the joint venture ST established in China with a local partner (total investment $3.2 billion) began volume production in Q4 2025, targeting 10,000 automotive-grade eight-inch wafers per week at full ramp (TrendForce, Mar 2025). Chinese players are going further, unveiling 12-inch and even 14-inch prototypes in quick succession to pull the format race forward (TrendForce, Mar 2026).
The transition is nonetheless running behind early expectations. Industry forecasts from around 2023–2024 saw eight-inch reaching roughly 15% of shipments by 2026, but TrendForce's May 2025 forecast puts the point at which eight-inch exceeds 20% of total shipments at 2030. Yole likewise expects the eight-inch platform to drive the market only in the regrowth phase, after 2027–2028. Why eight-inch is hard comes down, per industry technical commentary, to the crystal growth itself — at growth temperatures above 2,000°C, scaling the diameter makes temperature uniformity, thermal stress, bow and warp, and defect suppression (micropipes, basal plane dislocations) all harder at once, and SiC is far more difficult to slice and polish than silicon.
Meanwhile, a new demand axis has appeared. With NVIDIA formalizing its 800VDC data center architecture roadmap (Aug 2026), data center demand for SiC power devices is opening up, and Wolfspeed reported its FY2026 AI data center revenue more than doubled year over year. Separately, there are reports of SiC interposers being adopted in NVIDIA's Rubin platform (TrendForce, Nov 2025) — but that is thermal and packaging demand, different in kind from power device demand.